• DocumentCode
    3422968
  • Title

    Micro/nano glass press molding using silicon carbide molds fabricated by silicon lost molding

  • Author

    Min, Kyung-Oh ; Tanaka, Shuji ; Esashi, Masayoshi

  • Author_Institution
    Dept. of Nanomechanics, Tohoku Univ., Sendai, Japan
  • fYear
    2005
  • fDate
    30 Jan.-3 Feb. 2005
  • Firstpage
    475
  • Lastpage
    478
  • Abstract
    Silicon carbide (SiC) molds for micro/nano glass press molding at high temperature were fabricated from a silicon mold. The silicon molds with the features of micro-optics were fabricated by photolithography and etching and then SiC was deposited on the silicon mold. After the SiC surface was polished to a mirror surface, a SiC ceramic block was bonded with the SiC film using a nickel interlayer at 900 °C. Finally, the silicon mold was etched away using the mixture of nitric acid and hydrofluoric acid. The surface roughness of the SiC mold is 1.2 nm Ra, which is almost identical with that of the silicon mold. This suggests that this process is promising to make the SiC mold for optical uses. Glass press molding was preliminarily performed at 400 °C using the SiC mold coated with diamond-like carbon (DLC). Although some parts of the SiC film were peeled off due to poor SiC-SiC bonding quality, the features on the SiC mold were well transferred to the glass.
  • Keywords
    compression moulding; high-temperature techniques; micro-optics; micromachining; photolithography; silicon compounds; surface roughness; surface treatment; 1.2 nm; 400 C; 900 C; Ni; SiC; SiC ceramic block; SiC film; SiC-SiC bonding; diamond-like carbon; etching; hydrofluoric acid; micro glass press molding; micro optics; nano glass press molding; nickel interlayer; nitric acid; optical uses; photolithography; silicon carbide molds; silicon lost molding; surface roughness; Bonding; Etching; Glass; Lithography; Mirrors; Optical films; Rough surfaces; Silicon carbide; Surface roughness; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-8732-5
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2005.1453970
  • Filename
    1453970