Coupled 3D thermo-electro-mechanical simulations of microactuators

Author

Funk, J. ; Korvink, J.G. ; Bächtold, M. ; Bühler, J. ; Baltes, H.

Author_Institution

Phys. Electron. Lab., Eidgenossische Tech. Hochschule, Zurich, Switzerland

fYear

1996

fDate

11-15 Feb 1996

Firstpage

133

Lastpage

138

Abstract

We report 3D simulations of microactuators based on the solution of consistently coupled thermo-electro-mechanical equations. The necessary solution algorithms are implemented into the MEMS simulation environment SOLIDIS and allow efficient optimization studies of geometrically complex MEMS devices. Key issues are the solution of coupled equation systems using zone partitioning, adaptive mesh refinement, mesh updating using geometrical algorithms and field smoothing for the extraction of accurate electrostatic forces

Keywords

digital simulation; electrostatic devices; finite element analysis; mechanical engineering computing; microactuators; optimisation; smoothing methods; 3D simulation; MEMS simulation environment; SOLIDIS; adaptive mesh refinement; coupled thermo-electro-mechanical equations; electrostatic forces; field smoothing; geometrical algorithms; geometrically complex devices; mesh updating; microactuators; micromirror; optimization; zone partitioning; Capacitive sensors; Electrostatic actuators; Equations; Microactuators; Micromechanical devices; Mirrors; Solid modeling; Tensile stress; Thermal conductivity; Thermal force;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 1996, MEMS '96, Proceedings. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems. IEEE, The Ninth Annual International Workshop on

Conference_Location

San Diego, CA

Print_ISBN

0-7803-2985-6

Type

conf

DOI

10.1109/MEMSYS.1996.493842

Filename

493842