Surface tension analysis affecting deformation of solder bumps

Author

Ruangsinchaiwanich, S. ; Intachai, S. ; Nakem, P.

Author_Institution

Dept. of Electr. & Comput. Eng., Naresuan Univ., Phitsanuloke

fYear

2008

fDate

3-5 Sept. 2008

Firstpage

1

Lastpage

5

Abstract

Fault deformation of IC die components is likely found during the manufacturing process due to the smaller size of components. Therefore, this study aims to use the analytical method for analysis of bump shape change in the symmetrical and asymmetrical pattern. In particular, the asymmetrical pattern is focused since it is commonly found in the production process of IC die package. Different bump alloy are analyzed. The results show that the model of bump shape change in the asymmetrical pattern is reasonable. Additionally, some parameters of IC die package production, such as temperature used for melting bump, height of bump and surface tension of bump materials, can be investigated. These instructions give you basic guidelines for preparing camera-ready papers for conference proceedings.

Keywords

deformation; integrated circuit manufacture; solders; surface tension; IC die fault deformation; bump alloy; bump shape change; solder bump deformation; surface tension analysis; Assembly; Hard disks; Integrated circuit packaging; Manufacturing processes; Pattern analysis; Production; Propulsion; Shape memory alloys; Surface tension; Vehicles; Analytical method; Finite element method; Solders bump; Surface tension;

fLanguage

English

Publisher

ieee

Conference_Titel

Vehicle Power and Propulsion Conference, 2008. VPPC '08. IEEE

Conference_Location

Harbin

Print_ISBN

978-1-4244-1848-0

Electronic_ISBN

978-1-4244-1849-7

Type

conf

DOI

10.1109/VPPC.2008.4677743

Filename

4677743