DocumentCode
3423631
Title
Machine vision processing/selection in printed circuit board manufacturing
Author
Trivedi, Abhay ; Liu, Paul Cheng-Hsin
Author_Institution
Center for Adv. Electron. Manuf., North Carolina A&T State Univ., Greensboro, NC, USA
fYear
1997
fDate
9-11 Mar 1997
Firstpage
190
Lastpage
194
Abstract
Machine vision applications are common in the manufacturing of PWBs. Machine vision systems are used in the placement of surface mount devices with lead pitch of 0.025 inch or less. There are two steps in the successful placement of surface mount devices, as follows: (a) The location of the device on the vacuum tip which picks and places the device must be determined. Translation and rotational offsets are the difference between the device and the vacuum tip center and rotation. The part orientation (translational offset) and orientation angle (rotational offset) must be known for accurate placement. (b) The location offiducials (reference marks incorporated into the circuit pattern) must also be determined
Keywords
assembling; computer vision; printed circuit manufacture; surface mount technology; 0.025 in; location offiducials; machine vision processing/selection; part orientation; printed circuit board manufacturing; reference marks; rotational offsets; surface mount devices; translational offset; vacuum tip; Assembly; Conducting materials; Integrated circuit interconnections; Lead; Machine vision; Manufacturing processes; Printed circuits; Sheet materials; Surface-mount technology; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
System Theory, 1997., Proceedings of the Twenty-Ninth Southeastern Symposium on
Conference_Location
Cookeville, TN
ISSN
0094-2898
Print_ISBN
0-8186-7873-9
Type
conf
DOI
10.1109/SSST.1997.581605
Filename
581605
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