DocumentCode
3432923
Title
Mounting and packaging techniques for toroidal devices
Author
Tischler, Harold
Author_Institution
Torelco, Inc., Irvington, NJ, USA
fYear
1993
fDate
4-7 Oct 1993
Firstpage
261
Lastpage
262
Abstract
Mounting and packaging methods have been developed to accomodate the many and diverse requirements of modern toroidal equipment. The majority of them fall into the following categories, which are discussed in detail: open frame-self mounting; open frame with mounting device and/or hardware (includes surface mount); cased and potted; and metal cans
Keywords
packaging; cased toroidal devices; coils; metal cans; mounting techniques; open frame-self mounting; packaging techniques; potted toroidal devices; toroidal devices; toroidal equipment; Costs; Environmental economics; Hardware; Inductors; Lead; Packaging; Power generation economics; Power supplies; Switches; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Electronics Insulation Conference and Electrical Manufacturing & Coil Winding Conference, 1993. Proceedings., Chicago '93 EEIC/ICWA Exposition
Conference_Location
Chicago, IL
ISSN
1071-6270
Print_ISBN
0-7803-0847-6
Type
conf
DOI
10.1109/EEIC.1993.631068
Filename
631068
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