Processing, transfer solder bumping, chip attachment and testing of a thin film Cu/Photo-BCB MCM-D

Author

Ida, Yasunobu ; Garrou, Philip E. ; Strandjord, Andrew J G ; Cummings, Scott L. ; Rogers, W. Boyd ; Berry, Michele J. ; Kisting, Scott R.

Author_Institution

Dow Chem. Co., MCNC, Research Triangle Park, NC, USA

fYear

1995

fDate

4-6 Dec 1995

Firstpage

441

Lastpage

444

Abstract

The processing conditions for photosensitive BCB (Cyclotene** 4024-40 and Cyclotene** 4026-46) were defined for a thin film Cu/Photo-BCB MCM-D structure. Fabrication of four layer MCM-Ds, designed by Sandia National Laboratories, was demonstrated. The modules were electrically tested, solder bumped, flip chip assembled and put through a reliability test program

Keywords

flip-chip devices; integrated circuit reliability; integrated circuit testing; multichip modules; soldering; Cu; Cyclotene 4024-40; Cyclotene 4026-46; chip attachment; electrical testing; fabrication; flip chip assembly; photosensitive polymer dielectric; processing; reliability; thin film Cu/Photo-BCB MCM-D; transfer solder bumping; Chemical processes; Closed loop systems; Copper; Dielectric materials; Dielectric substrates; Dielectric thin films; Laboratories; Polymers; Testing; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International

Conference_Location

Omiya

Print_ISBN

0-7803-3622-4

Type

conf

DOI

10.1109/IEMT.1995.541081

Filename

541081