• DocumentCode
    3434047
  • Title

    Recombination lifetime measurements in SOI materials using a depletion-mode MOSFET

  • Author

    Vu, D.P. ; Henderson, W.R. ; Zavracky, P.M. ; Cheong, N.K.

  • Author_Institution
    Kopin Corp., Taunton, MA, USA
  • fYear
    1990
  • fDate
    2-4 Oct 1990
  • Firstpage
    67
  • Lastpage
    68
  • Abstract
    The authors measured recombination lifetime in SOI by using a depletion-mode MOSFET. The drain-source current transient of depletion-mode MOSFETs when a reversed step bias is applied to the gate is studied at elevated temperatures. A theoretical analysis is performed by considering the different generation processes as functions of temperature. At high temperature, the minority carriers required for the inversion charge come mainly from the quasi-neutral region beneath the depletion region and from the nearby Si film-buried oxide interface through a generation-diffusion process; generation from the depletion region is neglected as well as the generation from the front gate interface. This analysis leads to a determination of a function containing the drain-source current varying linearly with time
  • Keywords
    carrier lifetime; elemental semiconductors; insulated gate field effect transistors; minority carriers; semiconductor-insulator boundaries; silicon; SOI materials; Si-SiO2; depletion-mode MOSFET; drain-source current transient; generation-diffusion process; minority carriers; recombination lifetime measurements; reversed step bias; Bipolar transistors; Breakdown voltage; Diffusion processes; MOSFET circuits; Performance analysis; Semiconductor films; Temperature; Testing; Time measurement; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOS/SOI Technology Conference, 1990., 1990 IEEE
  • Conference_Location
    Key West, FL
  • Print_ISBN
    0-87942-573-3
  • Type

    conf

  • DOI
    10.1109/SOSSOI.1990.145712
  • Filename
    145712