DocumentCode
3434424
Title
Fast-cure liquid encapsulant for ICs
Author
Homma, Yoshinobu ; Fujiki, Tatsuhiro ; Kobayashi, Kiyoshi ; Shirai, Yukio ; Akazawa, Kenichi
Author_Institution
Hokuriku Toryo Co. Ltd., Niigata City, Japan
fYear
1995
fDate
4-6 Dec 1995
Firstpage
449
Lastpage
452
Abstract
A new fast-cure liquid encapsulant family has been developed. These materials can be cured for less 10 minutes at 150°C and have the characteristics that are equivalent to the purity of the conventional liquid encapsulant for Ics. (Cl-:5 ppm, K+ :1 ppm, Na+:1 ppm). Also, these materials are one-component type and the viscosity increase is approximately 20% after 48 hours at 25°C allowing flexible pot life. The fast-cure liquid encapsulants are suitable for TCP (Tape Carrier Package), COB (Chip On Board) and Flip Chip
Keywords
encapsulation; flip-chip devices; integrated circuit packaging; viscosity; 150 C; 25 C; IC; chip on board; fast-cure liquid encapsulant; flip chip; tape carrier package; viscosity; Adhesives; Assembly; Coatings; Costs; Curing; Flip chip; Glass; Packaging; Resins; Viscosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International
Conference_Location
Omiya
Print_ISBN
0-7803-3622-4
Type
conf
DOI
10.1109/IEMT.1995.541083
Filename
541083
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