PT/P(VDF-TrFE) hydrophone array

Author

Lau, Sien Ting ; Kwok, Kin Wing ; Chan, Helen Lai Wah

Author_Institution

Dept. of Appl. Phys., Hong Kong Polytech. Univ., Hunghom, China

fYear

2001

fDate

2001

Firstpage

71

Lastpage

74

Abstract

0-3 composite thin films of lead titanate (PT) in poly(vinylidene fluoride-trifluoroethylene) (PT/P(VDF-TrFE)) have been prepared by the spin-coating method. The piezoelectric coefficients of PT and P(VDF-TrFE) have opposite signs, while their pyroelectric coefficients have the same sign. The two phases of the composite film are then poled in opposite directions to prepare a piezoelectric film with vanishing pyroelectric response. An 8-element hydrophone array with this composite film as the sensing elements has been fabricated and characterized. The array has good receiving sensitivity over several MHz. The angular responses of the array elements are measured and the results are compared to a theoretical model. The acoustical and electrical cross coupling between the array elements are also discussed

Keywords

hydrophones; lead compounds; particle reinforced composites; piezoelectric thin films; piezoelectric transducers; polymer blends; pyroelectricity; spin coating; ultrasonic materials testing; ultrasonic transducer arrays; 0-3 composite thin films; P(VDF-TrFE); PT; PT/P(VDF-TrFE); PT/P(VDF-TrFE) hydrophone array; PbTiO₃; acoustical cross coupling; array element angular responses; array elements; composite film phase poling; composite film sensing elements; electrical cross coupling; hydrophone array; lead titanate; piezoelectric coefficients; piezoelectric film; poly(vinylidene fluoride-trifluoroethylene); pyroelectric coefficients; receiving sensitivity; spin-coating method; vanishing pyroelectric response; Acoustic measurements; Ceramics; Composite materials; Piezoelectric films; Polymers; Powders; Pyroelectricity; Sonar equipment; Temperature; Titanium compounds;

fLanguage

English

Publisher

ieee

Conference_Titel

Electron Devices Meeting, 2001. Proceedings. 2001 IEEE Hong Kong

Conference_Location

Hong Kong

Print_ISBN

0-7803-6714-6

Type

conf

DOI

10.1109/HKEDM.2001.946921

Filename

946921