• DocumentCode
    3434624
  • Title

    Silicon MCMs for parallel computing applications

  • Author

    McLaren, Moray ; Jamison, Ian

  • Author_Institution
    Meiko Ltd., Bristol, UK
  • fYear
    1993
  • fDate
    1993
  • Firstpage
    117
  • Lastpage
    118
  • Abstract
    Multichip module (MCM) technology is used in the design of large-scale, distributed memory, multiple-instruction, multiple-data (MIMD) processors. Two demonstrators have been selected for different applications within a parallel computer. The applications stress various aspects of the technology. The demonstrators are the design of high-performance processing nodes, and the construction of multistage switching networks. In both cases, implementations exist using conventional packaging technology, affording the opportunity to directly compare the performance of the solutions with respect to cost and various other design criteria.
  • Keywords
    elemental semiconductors; multichip modules; packaging; parallel architectures; silicon; MIMD processors; Si; Si MCMs; cost; high-performance processing nodes; multistage switching networks; packaging technology; parallel computing applications; Application software; Concurrent computing; Costs; Large-scale systems; Multichip modules; Packaging; Parallel processing; Process design; Silicon; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wafer Scale Integration, 1993. Proceedings., Fifth Annual IEEE International Conference on
  • Conference_Location
    San Francisco, CA, USA
  • Print_ISBN
    0-7803-0867-0
  • Type

    conf

  • DOI
    10.1109/ICWSI.1993.255267
  • Filename
    255267