• DocumentCode
    3434837
  • Title

    A wafer scale visual-to-thermal converter

  • Author

    Syrzycki, M.J. ; Carr, L. ; Chapman, G.H. ; Parameswaran, M.

  • Author_Institution
    Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
  • fYear
    1993
  • fDate
    1993
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    Wafer scale transducer arrays (WSTAs) containing multi-transducer arrays combined with processing circuits are produced using a combination of CMOS technology, silicon micromachining and laser interconnection techniques. A prototype wafer scale visual-to-thermal converter is being developed to convert a visual scene to thermal scene with the same resolution. The basic array is composed of transducer pixels, which combine photodetectors and thermal emitters as transducers, together with signal conditioning and control circuitry. The WSTA redundancy approach is driven by regularity in transducer location and emphasizes local over global transducer sparing.
  • Keywords
    CMOS integrated circuits; VLSI; image convertors; photodetectors; CMOS technology; control circuitry; laser interconnection techniques; local transducer sparing; multi-transducer arrays; photodetectors; redundancy approach; signal conditioning; silicon micromachining; thermal emitters; transducer location; transducer pixels; wafer scale visual-to-thermal converter; CMOS process; CMOS technology; Integrated circuit interconnections; Layout; Micromachining; Optical arrays; Prototypes; Signal resolution; Silicon; Transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wafer Scale Integration, 1993. Proceedings., Fifth Annual IEEE International Conference on
  • Conference_Location
    San Francisco, CA, USA
  • Print_ISBN
    0-7803-0867-0
  • Type

    conf

  • DOI
    10.1109/ICWSI.1993.255279
  • Filename
    255279