DocumentCode
3434837
Title
A wafer scale visual-to-thermal converter
Author
Syrzycki, M.J. ; Carr, L. ; Chapman, G.H. ; Parameswaran, M.
Author_Institution
Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
fYear
1993
fDate
1993
Firstpage
1
Lastpage
10
Abstract
Wafer scale transducer arrays (WSTAs) containing multi-transducer arrays combined with processing circuits are produced using a combination of CMOS technology, silicon micromachining and laser interconnection techniques. A prototype wafer scale visual-to-thermal converter is being developed to convert a visual scene to thermal scene with the same resolution. The basic array is composed of transducer pixels, which combine photodetectors and thermal emitters as transducers, together with signal conditioning and control circuitry. The WSTA redundancy approach is driven by regularity in transducer location and emphasizes local over global transducer sparing.
Keywords
CMOS integrated circuits; VLSI; image convertors; photodetectors; CMOS technology; control circuitry; laser interconnection techniques; local transducer sparing; multi-transducer arrays; photodetectors; redundancy approach; signal conditioning; silicon micromachining; thermal emitters; transducer location; transducer pixels; wafer scale visual-to-thermal converter; CMOS process; CMOS technology; Integrated circuit interconnections; Layout; Micromachining; Optical arrays; Prototypes; Signal resolution; Silicon; Transducers;
fLanguage
English
Publisher
ieee
Conference_Titel
Wafer Scale Integration, 1993. Proceedings., Fifth Annual IEEE International Conference on
Conference_Location
San Francisco, CA, USA
Print_ISBN
0-7803-0867-0
Type
conf
DOI
10.1109/ICWSI.1993.255279
Filename
255279
Link To Document