• DocumentCode
    3437254
  • Title

    Interconnection delay in very high-speed VLSI

  • Author

    Zhou, D. ; Preparata, F.P. ; Kang, S.M.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
  • fYear
    1988
  • fDate
    3-5 Oct 1988
  • Firstpage
    52
  • Lastpage
    55
  • Abstract
    Interconnection delay of VLSI has been a major bottleneck in the design of high-speed digital systems. The authors present a rigorous analysis of the signal propagation delay in VLSI circuits. They show that wire inductance is an important factor in determining the delay when the delay is in the subnanosecond range and that this delay cannot be well estimated by the conventional modeling of the interconnection by RC circuits. The effect of feature size scaling on circuit performance is also evaluated, and the inherent limitations on scaling due to interconnection delay is discussed. Finally, the relationship between the delay and the technology parameters, such as wire resistance, wire capacitance, wire inductance, wire width, wire length, and load capacitance is investigated to provide guidelines for the interconnection technology development
  • Keywords
    VLSI; delays; digital integrated circuits; RC circuits; VLSI circuits; circuit performance; feature size scaling; high-speed digital systems; important factor; interconnection delay; interconnection technology; load capacitance; signal propagation delay; subnanosecond range; technology parameters; very high-speed VLSI; wire capacitance; wire inductance; wire length; wire resistance; wire width; Capacitance; Circuit optimization; Delay estimation; Digital systems; Inductance; Integrated circuit interconnections; Propagation delay; Signal analysis; Very large scale integration; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design: VLSI in Computers and Processors, 1988. ICCD '88., Proceedings of the 1988 IEEE International Conference on
  • Conference_Location
    Rye Brook, NY
  • Print_ISBN
    0-8186-0872-2
  • Type

    conf

  • DOI
    10.1109/ICCD.1988.25658
  • Filename
    25658