A study of bonding reliability for substrate to metal cavity of microwave module

Author

Bin Yao ; Canxiong Lai ; Ping Li ; Zeya Peng

Author_Institution

Sci. & Technol. on Reliability Phys. & Applic. of Electron. Component Lab., CEPREI, Guangzhou, China

fYear

2013

fDate

15-18 July 2013

Firstpage

867

Lastpage

869

Abstract

The trend of most electronic products is toward higher operating frequencies. Recently the microwave modules have been used worldwide step by step in high frequency application. In this paper, the reliability of bonding between substrate and metal cavity of microwave module is studied. Two different kinds of bonding methods are introduced, which are bonding with adhesive or with solder paste respectively. The defects during two kinds of bonding process are investigated. The non-destructive bonding defects analysis techniques, such as X-ray inspection and scanning acoustic microscopy are presented. Furthermore, the effects of thermal cycling stress on bonding reliability for substrate to metal cavity of microwave module were investigated. The experimental results show that thermal cycling stress had limited influences on the adhesion between substrate and metal cavity which were bonded by solder. Finally several suggestions are given.

Keywords

acoustic microscopy; adhesive bonding; integrated circuit bonding; integrated circuit reliability; integrated circuit testing; microwave integrated circuits; solders; X-ray inspection; adhesive bonding; bonding reliability; electronic products; metal cavity; microwave module; nondestructive bonding defects analysis techniques; scanning acoustic microscopy; solder paste; substrate; thermal cycling stress; Bonding; Cavity resonators; Metals; Microwave theory and techniques; Reliability; Substrates; bonding reliability; delamination; microwave module; substrate; thermal cycling test; void;

fLanguage

English

Publisher

ieee

Conference_Titel

Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE), 2013 International Conference on

Conference_Location

Chengdu

Print_ISBN

978-1-4799-1014-4

Type

conf

DOI

10.1109/QR2MSE.2013.6625706

Filename

6625706