• DocumentCode
    3438991
  • Title

    Thermal Analysis of Sealed Electromagnetic Relays Using 3-D Finite Element Method

  • Author

    Liang, Huimin ; Wang, Wenlong ; Zhai, Guofu

  • Author_Institution
    Harbin Inst. of Technol. Harbin, Harbin
  • fYear
    2007
  • fDate
    16-19 Sept. 2007
  • Firstpage
    262
  • Lastpage
    268
  • Abstract
    Up to now, it is difficult to test the inner temperatures of sealed electromagnetic relays. In this paper, the temperature distribution of a sealed electromagnetic relay is obtained by using 3-D finite element analysis. The quality of thermal simulation results depends on the accuracy of both the modeled heat sources and heat sinks. Due to the high performance requirements of sealed electromagnetic relay it is interesting to know not only the temperatures of the conducting parts but also the thermal impact on the plastic components. Therefore, the non-metallic parts of the sealed electromagnetic relay (including the air within the device) are now part of the model. In order to improve the accuracy of simulation, the contact radius is calculated in advance. The relationship between convection heat transfer coefficient and temperature and how to consider connecting wires boundary condition are also researched here. Finally, the temperature distribution of a sealed electromagnetic relay is obtained by this method. Comparisons with experimental results confirm its validity.
  • Keywords
    convection; finite element analysis; heat sinks; relays; thermal analysis; 3-D finite element method; connecting wires boundary condition; convection heat transfer coefficient; heat sinks; heat sources; plastic components; sealed electromagnetic relays; temperature distribution; thermal analysis; thermal simulation; Electromagnetic analysis; Electromagnetic devices; Electromagnetic modeling; Finite element methods; Heat sinks; Plastics; Relays; Temperature distribution; Testing; Thermal conductivity; finite element method; sealed electromagnetic relay; thermal analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical contacts - 2007, the 53rd ieee holm conference on
  • Conference_Location
    Pittsburgh, PA
  • Print_ISBN
    1-4244-0837-7
  • Electronic_ISBN
    1-4244-0838-5
  • Type

    conf

  • DOI
    10.1109/HOLM.2007.4318227
  • Filename
    4318227