DocumentCode
3438991
Title
Thermal Analysis of Sealed Electromagnetic Relays Using 3-D Finite Element Method
Author
Liang, Huimin ; Wang, Wenlong ; Zhai, Guofu
Author_Institution
Harbin Inst. of Technol. Harbin, Harbin
fYear
2007
fDate
16-19 Sept. 2007
Firstpage
262
Lastpage
268
Abstract
Up to now, it is difficult to test the inner temperatures of sealed electromagnetic relays. In this paper, the temperature distribution of a sealed electromagnetic relay is obtained by using 3-D finite element analysis. The quality of thermal simulation results depends on the accuracy of both the modeled heat sources and heat sinks. Due to the high performance requirements of sealed electromagnetic relay it is interesting to know not only the temperatures of the conducting parts but also the thermal impact on the plastic components. Therefore, the non-metallic parts of the sealed electromagnetic relay (including the air within the device) are now part of the model. In order to improve the accuracy of simulation, the contact radius is calculated in advance. The relationship between convection heat transfer coefficient and temperature and how to consider connecting wires boundary condition are also researched here. Finally, the temperature distribution of a sealed electromagnetic relay is obtained by this method. Comparisons with experimental results confirm its validity.
Keywords
convection; finite element analysis; heat sinks; relays; thermal analysis; 3-D finite element method; connecting wires boundary condition; convection heat transfer coefficient; heat sinks; heat sources; plastic components; sealed electromagnetic relays; temperature distribution; thermal analysis; thermal simulation; Electromagnetic analysis; Electromagnetic devices; Electromagnetic modeling; Finite element methods; Heat sinks; Plastics; Relays; Temperature distribution; Testing; Thermal conductivity; finite element method; sealed electromagnetic relay; thermal analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical contacts - 2007, the 53rd ieee holm conference on
Conference_Location
Pittsburgh, PA
Print_ISBN
1-4244-0837-7
Electronic_ISBN
1-4244-0838-5
Type
conf
DOI
10.1109/HOLM.2007.4318227
Filename
4318227
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