• DocumentCode
    3443499
  • Title

    Notice of Retraction
    Measurement of ESD protection structure irradiation degradation using TLP method

  • Author

    Qian Shi ; Qing-Zhong Xiao ; Yuan Liu ; Yun-fei En

  • Author_Institution
    Sci. & Technol. on Reliability Phys. & Applic. of Electron. Component Lab., China Electron. Produce Reliability, Guangzhou, China
  • fYear
    2013
  • fDate
    15-18 July 2013
  • Firstpage
    2029
  • Lastpage
    2030
  • Abstract
    Notice of Retraction

    After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.

    We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.

    The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.

    Ionization radiation causes ESD protection structure of integrated circuit degradation. A new method using Transmission Line Pulse (TLP) test is introduced in this article; this method gives more detailed information of the ESD protection structure´s degradation. Turn-on voltage, hold voltage, turn-on resistance of two type ESD protection structures are measured before and after TID radiation test, results are discussed.
  • Keywords
    electrostatic discharge; integrated circuit reliability; integrated circuit testing; ionisation; transmission lines; ESD protection structure irradiation degradation; TID radiation test; TLP method; hold voltage; integrated circuit degradation; ionization radiation; transmission line pulse test; turn-on resistance; turn-on voltage; Degradation; Electrostatic discharges; Integrated circuits; Leakage currents; Power transmission lines; Transmission line measurements; Voltage measurement; ESD; total dose radiation; transmission line pulse;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE), 2013 International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4799-1014-4
  • Type

    conf

  • DOI
    10.1109/QR2MSE.2013.6625980
  • Filename
    6625980