DocumentCode
3444666
Title
Enhanced lateral electromechanical coupling in lead-titanate-rod/polymer piezoelectric composites
Author
Smith, Wallace Arden ; Shaulov, Avner A. ; Ting, Robert Y.
Author_Institution
North American Philips Corp., Briarcliff Manor, NY, USA
fYear
1988
fDate
2-5 Oct 1988
Firstpage
617
Abstract
Although modified lead-titanate ceramics exhibit a negligible d 31 piezoelectric coefficient, piezoelectric-rod/polymer-matrix composites made from them exhibit a substantial d 31. A theoretical analysis shows that the composite´s enhanced d 31 coefficient arises from lateral stress on the polymer phase being transferred to a longitudinal stress along the ceramic rods by the Poisson effect in the polymer, thus producing a charge through the ceramic´s d 33. For hydrophone applications, this enhanced d 31 suppresses the hydrostatic response so that the composite´s hydrophone figure of merit, d hg h, is less than that of the constituent ceramic. Nevertheless, the composite´s still substantial d hg h, high g h coefficient, remarkable pressure stability, low density, formability, and availability in thick sheets provide advantages for naval applications. In ultrasonic transducer applications, the composite structure provides no enhancement in electromechanical coupling, since the modified lead-titanate´s k 33 is nearly the same as its k t. These expectations are in good agreement with measurements on 1-3 modified lead-titanate/polymer composites made by the dice-and-fill technique
Keywords
composite materials; lead compounds; piezoelectric materials; polymers; ultrasonic transducers; PbTiO3; Poisson effect; ceramic; hydrophone; hydrostatic response; lateral electromechanical coupling; piezoelectric coefficient; piezoelectric composites; polymer; ultrasonic transducer; Ceramics; Composite materials; Lead; Polymers; Sonar equipment; Stress; Titanium compounds; Ultrasonic transducer arrays; Ultrasonic transducers; Ultrasonic variables measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 1988. Proceedings., IEEE 1988
Conference_Location
Chicago, IL
Type
conf
DOI
10.1109/ULTSYM.1988.49451
Filename
49451
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