• DocumentCode
    3444666
  • Title

    Enhanced lateral electromechanical coupling in lead-titanate-rod/polymer piezoelectric composites

  • Author

    Smith, Wallace Arden ; Shaulov, Avner A. ; Ting, Robert Y.

  • Author_Institution
    North American Philips Corp., Briarcliff Manor, NY, USA
  • fYear
    1988
  • fDate
    2-5 Oct 1988
  • Firstpage
    617
  • Abstract
    Although modified lead-titanate ceramics exhibit a negligible d31 piezoelectric coefficient, piezoelectric-rod/polymer-matrix composites made from them exhibit a substantial d31. A theoretical analysis shows that the composite´s enhanced d31 coefficient arises from lateral stress on the polymer phase being transferred to a longitudinal stress along the ceramic rods by the Poisson effect in the polymer, thus producing a charge through the ceramic´s d33. For hydrophone applications, this enhanced d31 suppresses the hydrostatic response so that the composite´s hydrophone figure of merit, dhgh, is less than that of the constituent ceramic. Nevertheless, the composite´s still substantial dhgh, high gh coefficient, remarkable pressure stability, low density, formability, and availability in thick sheets provide advantages for naval applications. In ultrasonic transducer applications, the composite structure provides no enhancement in electromechanical coupling, since the modified lead-titanate´s k33 is nearly the same as its kt. These expectations are in good agreement with measurements on 1-3 modified lead-titanate/polymer composites made by the dice-and-fill technique
  • Keywords
    composite materials; lead compounds; piezoelectric materials; polymers; ultrasonic transducers; PbTiO3; Poisson effect; ceramic; hydrophone; hydrostatic response; lateral electromechanical coupling; piezoelectric coefficient; piezoelectric composites; polymer; ultrasonic transducer; Ceramics; Composite materials; Lead; Polymers; Sonar equipment; Stress; Titanium compounds; Ultrasonic transducer arrays; Ultrasonic transducers; Ultrasonic variables measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 1988. Proceedings., IEEE 1988
  • Conference_Location
    Chicago, IL
  • Type

    conf

  • DOI
    10.1109/ULTSYM.1988.49451
  • Filename
    49451