• DocumentCode
    3446737
  • Title

    Analysis of bundle losses in high speed machines

  • Author

    Reddy, Patel B. ; Jahns, T.M.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Wisconsin, Madison, WI, USA
  • fYear
    2010
  • fDate
    21-24 June 2010
  • Firstpage
    2181
  • Lastpage
    2188
  • Abstract
    Elevated frequencies in high-speed ac machines increase the skin effect in stator windings, making it necessary in many cases to divide each phase winding into high numbers of small-diameter strands connected in parallel. Unfortunately, circulating currents among the strands in a single bundle can significantly increase the total copper losses depending on several factors including the twisting (i.e., transposition) of the strands in the bundles. An analytical model for these bundle proximity losses is presented for individual bundles as well as slot-bound bundles configured for high-speed machines. Loss predictions provided by this model match well with finite element results for high-speed operation of a 55 kW (peak) PM machine with concentrated windings. Stators with litz and non-transposed windings are compared to highlight the large differences in their bundle proximity losses. Analytical and finite element results are shown to match well with experimental results at frequencies of 700 and 800 Hz.
  • Keywords
    AC machines; finite element analysis; losses; permanent magnet machines; skin effect; stators; PM machine; analytical model; bundle proximity losses; concentrated windings; copper losses; finite element results; frequency 700 Hz; frequency 800 Hz; high-speed AC machines; litz winding; loss predictions; nontransposed windings; power 55 kW; skin effect; slot-bound bundles; stator windings; AC machines; Analytical models; Finite element methods; Frequency; Machine windings; Predictive models; Proximity effect; Skin effect; Stator windings; Transformers; AC losses; ac machines; brushless machines; bundle losses; high efficiency; high speed; proximity losses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics Conference (IPEC), 2010 International
  • Conference_Location
    Sapporo
  • Print_ISBN
    978-1-4244-5394-8
  • Type

    conf

  • DOI
    10.1109/IPEC.2010.5542354
  • Filename
    5542354