DocumentCode
3446900
Title
A new degradation mode for advanced heterojunction bipolar transistors under reverse bias stress
Author
Ruat, M. ; Angers, R. ; Ghibaudo, G. ; Revil, N. ; Pananakakis, G.
fYear
2005
fDate
17-20 Oct. 2005
Abstract
This work shows and discusses the occurrence of a new failure mechanism affecting both collector and base currents under reverse BE junction stress. This is evident for very advanced SiGe and SiGe:C HBTs. This failure mode only affects the first steps of the degradation, exhibiting a correlated decrease of both base and collector currents, while keeping their ideality. Several experiments and analyses have been conducted for better understanding of this failure mode
Keywords
Ge-Si alloys; carbon; failure analysis; heterojunction bipolar transistors; semiconductor device reliability; SiGe:C; base current; collector current; degradation mode; failure mechanism; failure mode; heterojunction bipolar transistors; reverse BE junction stress; reverse bias stress; CMOS technology; Degradation; Doping profiles; Failure analysis; Germanium silicon alloys; Heterojunction bipolar transistors; Hot carriers; Isolation technology; Silicon germanium; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 2005 IEEE International
Conference_Location
S. Lake Tahoe, CA
Print_ISBN
0-7803-8992-1
Type
conf
DOI
10.1109/IRWS.2005.1609563
Filename
1609563
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