• DocumentCode
    3446900
  • Title

    A new degradation mode for advanced heterojunction bipolar transistors under reverse bias stress

  • Author

    Ruat, M. ; Angers, R. ; Ghibaudo, G. ; Revil, N. ; Pananakakis, G.

  • fYear
    2005
  • fDate
    17-20 Oct. 2005
  • Abstract
    This work shows and discusses the occurrence of a new failure mechanism affecting both collector and base currents under reverse BE junction stress. This is evident for very advanced SiGe and SiGe:C HBTs. This failure mode only affects the first steps of the degradation, exhibiting a correlated decrease of both base and collector currents, while keeping their ideality. Several experiments and analyses have been conducted for better understanding of this failure mode
  • Keywords
    Ge-Si alloys; carbon; failure analysis; heterojunction bipolar transistors; semiconductor device reliability; SiGe:C; base current; collector current; degradation mode; failure mechanism; failure mode; heterojunction bipolar transistors; reverse BE junction stress; reverse bias stress; CMOS technology; Degradation; Doping profiles; Failure analysis; Germanium silicon alloys; Heterojunction bipolar transistors; Hot carriers; Isolation technology; Silicon germanium; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 2005 IEEE International
  • Conference_Location
    S. Lake Tahoe, CA
  • Print_ISBN
    0-7803-8992-1
  • Type

    conf

  • DOI
    10.1109/IRWS.2005.1609563
  • Filename
    1609563