DocumentCode

3447151

Title

Discussion Group Summary Wafer-level Reliability Techniques

Author

Pierce, D.G.

Author_Institution

Sandia Technologies, Inc.

fYear

1996

fDate

20-23 Oct. 1996

Firstpage

159

Lastpage

160

Keywords

Dielectrics; Diodes; Monitoring; Passivation; Plasma applications; Process control; Production; Qualifications; Research and development; Standardization;

fLanguage

English

Publisher

ieee

Conference_Titel

Integrated Reliability Workshop, 1996., IEEE International

Conference_Location

Lake Tahoe, CA, USA

Print_ISBN

0-7803-3598-8

Type

conf

DOI

10.1109/IRWS.1996.583401

Filename

583401