Mode-matching analysis of substrate-integrated waveguide circuits

Author

Bornemann, Jens ; Taringou, Farzaneh

Author_Institution

Dept. of Electr. & Comput. Eng., Univ. of Victoria, Victoria, BC, Canada

fYear

2011

fDate

8-11 May 2011

Abstract

A mode-matching approach is presented for the analysis of substrate-integrated waveguide (SIW) circuits. The numerical technique takes advantage of recently developed fabrication techniques employing rectangular-shaped via holes. Discontinuity models involving all-dielectric waveguides and sections with arbitrary numbers of vias are presented and combined into a powerful analysis tool which can be used straightforwardly for the design of SIW components. The influence of the overall substrate width on the circuit performance is investigated. It is found that the computational domain can be significantly reduced without impacting on the computed performances. A design example involving a back-to-back impedance transformer is presented. The results are verified by comparison with the commercially available field solver CST Microwave Studio.

Keywords

dielectric waveguides; impedance convertors; substrate integrated waveguides; SIW components; all-dielectric waveguides; back-to-back impedance transformer; circuit performance; field solver CST Microwave Studio; mode-matching analysis; numerical technique; substrate-integrated waveguide circuits; Electromagnetic waveguides; Integrated circuit modeling; Microwave circuits; Microwave filters; Substrates; Transmission line matrix methods; Substrate-integrated waveguide technology; computer-aided design; mode-matching techniques; numerical modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical and Computer Engineering (CCECE), 2011 24th Canadian Conference on

Conference_Location

Niagara Falls, ON

ISSN

0840-7789

Print_ISBN

978-1-4244-9788-1

Electronic_ISBN

0840-7789

Type

conf

DOI

10.1109/CCECE.2011.6030517

Filename

6030517