• DocumentCode
    3457395
  • Title

    Silicon carbide diode bridge circuit for capacitive sensor readout in high temperature (673K) environmnet

  • Author

    Chand, R. ; Tanaka, Shoji ; Esashi, Masayoshi

  • Author_Institution
    Dept. of Nanomech., Tohoku Univ., Sendai, Japan
  • fYear
    2013
  • fDate
    16-20 June 2013
  • Firstpage
    1020
  • Lastpage
    1023
  • Abstract
    Sensing using a micro-device at high temperature is a critical problem as a Si readout circuit does not work at high temperature, even if a sensor itself is heat-resistive. We for the first time proposed and demonstrated a SiC diode bridge circuit for capacitive sensor readout at high temperature. SiC pn-junction diodes were tested at high temperature up to 673 K. The SiC diode circuit was constructed on a sapphire substrate with Ni wedge wire bonding and die attach using high temperature conductive paste. The concept was demonstrated using a MOS capacitor bank as a dummy sensor, and differential capacitance was successfully read at 673 K.
  • Keywords
    MOS capacitors; bridge circuits; capacitive sensors; high-temperature techniques; lead bonding; microsensors; p-n junctions; readout electronics; sapphire; semiconductor diodes; shapes (structures); silicon compounds; Al2O3; MOS capacitor bank; PN junction diode; SiC diode bridge circuit; SiC-Al2O3-Ni; capacitive sensor readout circuit; die attach; differential capacitance; dummy sensor; heat resistive sensor; high temperature conductive paste; high temperature environment; microdevice; sapphire substrate; temperature 673 K; wedge wire bonding; Bridge circuits; Capacitive sensors; Nickel; Semiconductor diodes; Silicon carbide; Temperature; Temperature sensors; Capacitive sensor; Diode bridge circuit; High temperature sensor; Readout circuit; SiC diode;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), 2013 Transducers & Eurosensors XXVII: The 17th International Conference on
  • Conference_Location
    Barcelona
  • Type

    conf

  • DOI
    10.1109/Transducers.2013.6626943
  • Filename
    6626943