• DocumentCode
    3458735
  • Title

    Comprehending scaling effects on plasma damage

  • Author

    Krishnan, Anand T. ; Krishnan, Srikanth

  • Author_Institution
    Silicon Technol. Dev., Texas Instrum. Inc., Dallas, TX, USA
  • fYear
    2003
  • fDate
    24-25 April 2003
  • Firstpage
    28
  • Lastpage
    31
  • Abstract
    The dependence of the gate oxide current (during plasma processes) on the antenna ratio determines the significance of plasma damage for the product. This relationship is shown to be linear in the plasma-current limited regime and sub-linear in the plasma-voltage limited regime. The implication of this sub-linear dependence is that the fail fraction at high antenna ratio is not a reliable indicator of susceptibility to charging damage, and a complete model incorporating plasma and oxide current-voltage characteristics is necessary for accurate assessment of charging damage.
  • Keywords
    MOSFET; plasma materials processing; semiconductor technology; surface charging; NMOS; PMOS; antenna ratio; charging damage susceptibility; fail fraction; gate oxide current; linear relationship; oxide current-voltage characteristics; plasma damage; plasma processes; plasma-current limited regime; plasma-voltage limited regime; scaling effects; sublinear relationship; Current density; Dielectrics; Instruments; MOS devices; Plasma density; Plasma materials processing; Plasma properties; Silicon; Stress; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma- and Process-Induced Damage, 2003 8th International Symposium
  • Print_ISBN
    0-7803-7747-8
  • Type

    conf

  • DOI
    10.1109/PPID.2003.1199723
  • Filename
    1199723