DocumentCode
3458735
Title
Comprehending scaling effects on plasma damage
Author
Krishnan, Anand T. ; Krishnan, Srikanth
Author_Institution
Silicon Technol. Dev., Texas Instrum. Inc., Dallas, TX, USA
fYear
2003
fDate
24-25 April 2003
Firstpage
28
Lastpage
31
Abstract
The dependence of the gate oxide current (during plasma processes) on the antenna ratio determines the significance of plasma damage for the product. This relationship is shown to be linear in the plasma-current limited regime and sub-linear in the plasma-voltage limited regime. The implication of this sub-linear dependence is that the fail fraction at high antenna ratio is not a reliable indicator of susceptibility to charging damage, and a complete model incorporating plasma and oxide current-voltage characteristics is necessary for accurate assessment of charging damage.
Keywords
MOSFET; plasma materials processing; semiconductor technology; surface charging; NMOS; PMOS; antenna ratio; charging damage susceptibility; fail fraction; gate oxide current; linear relationship; oxide current-voltage characteristics; plasma damage; plasma processes; plasma-current limited regime; plasma-voltage limited regime; scaling effects; sublinear relationship; Current density; Dielectrics; Instruments; MOS devices; Plasma density; Plasma materials processing; Plasma properties; Silicon; Stress; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma- and Process-Induced Damage, 2003 8th International Symposium
Print_ISBN
0-7803-7747-8
Type
conf
DOI
10.1109/PPID.2003.1199723
Filename
1199723
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