• DocumentCode
    3460824
  • Title

    A compact model of holding voltage for latch-up in epitaxial CMOS

  • Author

    Chen, Ming-Jer ; Hou, Chin-Shan ; Tseng, Pin-Nan ; Shiue, Ruey-Yun ; Lee, Hun-Shung ; Chen, Jyh-Huei ; Jeng, Jeng-Kuo ; Jou, Yeh-Ning

  • Author_Institution
    Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    1997
  • fDate
    8-10 Apr 1997
  • Firstpage
    339
  • Lastpage
    345
  • Abstract
    From different fabrication processes down to 0.35 μm feature size and from two-dimensional device simulation, the holding voltage V H for latch-up in epitaxial CMOS is found to be proportional to the square root of the holding current IH, specially for V H⩾2 V, while for VH<2 V the VH linearly follows the IH. A slight modification of existing physically-based analytical models is set up for reproduction of all the observed dependencies, valid for different epitaxial layer thicknesses (tepi) and different anode-to-cathode spacings (L), along with a self-consistent interpretation by exploring the role of the base pushout width (h). By incorporating a structure-oriented holding current formula to this modified model, a compact, closed-form expression for V H is produced directly as a function of tepi and L. The compact model can serve as the scaling law for the holding voltage down to 1 V. The potential application of the compact model to low voltage, low power CMOS integrated circuits for latchup free operation is also projected
  • Keywords
    CMOS integrated circuits; circuit analysis computing; integrated circuit modelling; integrated circuit reliability; 0.35 mum; 1 to 5 V; anode-to-cathode spacings; base pushout width; closed-form expression; epitaxial CMOS; epitaxial layer thickness; fabrication processes; feature size; holding current; holding voltage model; latch-up; latchup free operation; low voltage low power CMOS integrated circuits; physically-based analytical models; scaling law; self-consistent interpretation; structure-oriented holding current formula; two-dimensional device simulation; Analytical models; CMOS integrated circuits; CMOS process; Closed-form solution; Epitaxial layers; Fabrication; Integrated circuit modeling; Low voltage; Semiconductor device modeling; Semiconductor process modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1997. 35th Annual Proceedings., IEEE International
  • Conference_Location
    Denver, CO
  • Print_ISBN
    0-7803-3575-9
  • Type

    conf

  • DOI
    10.1109/RELPHY.1997.584284
  • Filename
    584284