DocumentCode
3461226
Title
Multilayer RF PCB for space applications: technological and interconnections trade-off
Author
Paillard, M. ; Bodereau, F. ; Drevon, C. ; Monfraix, P. ; Cazaux, J.L. ; Bodin, L. ; Guyon, P.
Author_Institution
Alcatel Space, Toulouse, France
Volume
3
fYear
2005
fDate
4-6 Oct. 2005
Abstract
Multilayer RF printed circuits boards with embedded passives are complex structures to manufacture and to package while keeping good RF performances. In this paper, technological solutions aimed at simplifying these issues are proposed: the use of thermoset materials instead of thermoplastic laminates and an original interconnection technique based on "RF openings" machined in the edges of the boards. Two breadboards based on these solutions have been developed and demonstrate very good RF performances between 5 and 15 GHz.
Keywords
interconnections; microwave circuits; printed circuits; 5 to 15 GHz; RF openings; embedded passives; interconnection technique; multilayer RF printed circuits boards; space applications; technological solutions; thermoset materials; Assembly; Dielectric substrates; Integrated circuit interconnections; Laminates; Manufacturing; Nonhomogeneous media; Packaging machines; Printed circuits; Radio frequency; Space technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2005 European
Print_ISBN
2-9600551-2-8
Type
conf
DOI
10.1109/EUMC.2005.1610270
Filename
1610270
Link To Document