• DocumentCode
    3463504
  • Title

    The influence of source and drain junction depth on the sub-50nm MOSFET devices

  • Author

    Su-zhen, Luan ; Hong-xia, Liu ; Yue, Hao

  • Author_Institution
    Sch. of Microelectron., Xidian Univ., Xi´´an
  • fYear
    2006
  • fDate
    23-26 Oct. 2006
  • Firstpage
    263
  • Lastpage
    265
  • Abstract
    This brief investigates the influence of source and drain junction depth on the short-channel effect (SCE) in highly scaled MOSFETs. It is shown using two-dimensional finite-element device simulation that the influence of source and drain junction depth on SCE can be represented by an additional of a pre-exponential term to the established scale-length model. For source and drain junction depths that are deeper than the MOSFET´s gate depletion-layer width, SCE is shown with this pre-exponential term to be insensitive to junction depth. Conversely, for source and drain junction depths that are shallower than the MOSFET´s gate depletion-layer width, SCE is shown to improve with decreasing junction depth. Finally, the influence on off-current of source and drain junction depths is given
  • Keywords
    MOSFET; finite element analysis; semiconductor device models; semiconductor junctions; 2D finite-element device simulation; MOSFET devices; MOSFET´s gate depletion-layer width; pre-exponential term; scale-length model; short-channel effect; source and drain junction depth; Current-voltage characteristics; Equations; Failure analysis; Finite element methods; Impurities; Insulation; MOSFET circuits; Microelectronics; Semiconductor materials; Wide band gap semiconductors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0160-7
  • Electronic_ISBN
    1-4244-0161-5
  • Type

    conf

  • DOI
    10.1109/ICSICT.2006.306180
  • Filename
    4098080