DocumentCode
3463504
Title
The influence of source and drain junction depth on the sub-50nm MOSFET devices
Author
Su-zhen, Luan ; Hong-xia, Liu ; Yue, Hao
Author_Institution
Sch. of Microelectron., Xidian Univ., Xi´´an
fYear
2006
fDate
23-26 Oct. 2006
Firstpage
263
Lastpage
265
Abstract
This brief investigates the influence of source and drain junction depth on the short-channel effect (SCE) in highly scaled MOSFETs. It is shown using two-dimensional finite-element device simulation that the influence of source and drain junction depth on SCE can be represented by an additional of a pre-exponential term to the established scale-length model. For source and drain junction depths that are deeper than the MOSFET´s gate depletion-layer width, SCE is shown with this pre-exponential term to be insensitive to junction depth. Conversely, for source and drain junction depths that are shallower than the MOSFET´s gate depletion-layer width, SCE is shown to improve with decreasing junction depth. Finally, the influence on off-current of source and drain junction depths is given
Keywords
MOSFET; finite element analysis; semiconductor device models; semiconductor junctions; 2D finite-element device simulation; MOSFET devices; MOSFET´s gate depletion-layer width; pre-exponential term; scale-length model; short-channel effect; source and drain junction depth; Current-voltage characteristics; Equations; Failure analysis; Finite element methods; Impurities; Insulation; MOSFET circuits; Microelectronics; Semiconductor materials; Wide band gap semiconductors;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location
Shanghai
Print_ISBN
1-4244-0160-7
Electronic_ISBN
1-4244-0161-5
Type
conf
DOI
10.1109/ICSICT.2006.306180
Filename
4098080
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