DocumentCode
3463967
Title
Modeling the cost of ownership of assembly and inspection
Author
Dance, Daren L. ; DiFloria, Thomas ; Jimenez, David W.
Author_Institution
Wright Williams & Kelly, Austin, TX, USA
fYear
1995
fDate
2-4 Oct 1995
Firstpage
51
Lastpage
54
Abstract
This paper will use a manufacturing example to illustrate the impacts of robustness, repeatability, and accuracy on COO. By considering life cycle costs as a function of the total number of good devices manufactured over the equipment life, the COO impact of manufacturing and inspection can be estimated in terms of cost per good unit
Keywords
assembling; costing; economics; inspection; integrated circuit manufacture; semiconductor process modelling; accuracy; assembly; cost of ownership; cost per good unit; inspection; life cycle costs; manufacturing; modelling; repeatability; robustness; semiconductor process step cost; wafer fabrication tool; Assembly; Assembly systems; Calibration; Cost function; Costs; Fabrication; Inspection; Life estimation; Manufacturing; Pulp manufacturing; Robustness; Semiconductor device modeling; Semiconductor materials; Standards development; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International
Conference_Location
Austin, TX
Print_ISBN
0-7803-2996-1
Type
conf
DOI
10.1109/IEMT.1995.526090
Filename
526090
Link To Document