• DocumentCode
    3464134
  • Title

    Role of oxygen states in high-K gate stack engineering

  • Author

    Takeuchi, Hideki ; Shiraishi, Kenji ; Liu, Tsu-Jae King

  • Author_Institution
    ATDF Inc., Austin, TX
  • fYear
    2006
  • fDate
    23-26 Oct. 2006
  • Firstpage
    388
  • Lastpage
    391
  • Abstract
    Fundamental properties of SiO2 and high-k dielectrics are compared, and the differences can be used to explain physical phenomena in high-k gate stacks. Interfacial reactions and gate Fermi-level pinning arise from the ionic nature of oxygen states in high-k dielectrics. Film crystallization is actually preferable for high-k gate dielectrics due to their lack of bond flexibility, while phase separation in silicates must be avoided because it leads to severe degradation of film properties
  • Keywords
    Fermi level; crystallisation; defect states; dielectric materials; interface states; silicon compounds; Fermi-level pinning; SiO2; bond flexibility; defect states; film crystallization; high-k dielectrics; high-k gate stacks; interfacial reactions; Bonding; Crystallization; Electrons; Hafnium; High K dielectric materials; High-K gate dielectrics; Inorganic materials; Leakage current; Oxidation; Oxygen;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0160-7
  • Electronic_ISBN
    1-4244-0161-5
  • Type

    conf

  • DOI
    10.1109/ICSICT.2006.306259
  • Filename
    4098116