• DocumentCode
    3466658
  • Title

    Performance implications of next generation PowerPC/sup TM/ microprocessor cache architectures

  • Author

    Reinold, J.

  • Author_Institution
    Commercial Syst. Eng., Motorola Comput. Group, Tempe, AZ, USA
  • fYear
    1997
  • fDate
    23-26 Feb. 1997
  • Firstpage
    331
  • Lastpage
    338
  • Abstract
    Modern CISC and RISC microprocessors use sophisticated caching schemes to bridge the performance mismatch between their internal execution units and the capabilities of commodity memory technologies. A variety of cache architectures and organizations have been developed and are finding use in current and future high-performance computer systems. Designers of systems with next-generation PowerPC/sup TM/ microprocessors face similar challenges. System performance implications for various cache architectures (look-aside, in-line, back-side) and cache organizations (direct-mapped, set-associative) need to be understood so that cost-effective cache hierarchies can be built. This paper presents the results of an analysis done at the Motorola Computer Group to characterize the required properties of a cache hierarchy for a next-generation G3 PowerPC superscalar low-power microprocessor.
  • Keywords
    cache storage; memory architecture; microprocessor chips; performance evaluation; reduced instruction set computing; CISC microprocessors; Motorola Computer Group; RISC microprocessors; back-side buffers; commodity memory technologies; cost-effective cache hierarchies; direct-mapped cache organization; in-line buffers; internal execution units; look-aside buffers; microprocessor cache architectures; next-generation G3 PowerPC superscalar low-power microprocessor; performance mismatch; set-associative cache organization; system performance implications; Bridges; Computer architecture; Costs; Microprocessors; Modems; Power engineering and energy; Power engineering computing; Reduced instruction set computing; System performance; Systems engineering and theory;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Compcon '97. Proceedings, IEEE
  • Conference_Location
    San Jose, CA, USA
  • ISSN
    1063-6390
  • Print_ISBN
    0-8186-7804-6
  • Type

    conf

  • DOI
    10.1109/CMPCON.1997.584746
  • Filename
    584746