DocumentCode
3467936
Title
Electrical conduction and reliability of anisotropic conductive adhesives filled with Ag/Cu-coated epoxy composite particles
Author
Zhihong, Lei ; Ying, He ; Licong, Gao
Author_Institution
Dept. of Polymer Mater., Shanghai Univ.
fYear
2006
fDate
Oct. 2006
Firstpage
1034
Lastpage
1036
Abstract
Electrical conductivity and shear strength of epoxy resin filled with Ag/Cu-coated composite particles were studied in this paper. Taking these two factors into account, the optimum concentration of filler was determined to be 12 vol. %. This paper explained that electrical properties of ACFs with different film thickness by experiment. Aging test showed that ACF filled with Ag/Cu-coated composite particles had good thermal stability
Keywords
conductive adhesives; copper; electrical conductivity; polymers; silver; thermal stability; Ag/Cu-coated; anisotropic conductive adhesives; conductive particle; contact resistance; electrical conductivity; electrical reliability; epoxy composite particles; shear strength; thermal stability; Anisotropic magnetoresistance; Conductive adhesives; Conductivity; Contact resistance; Electrodes; Electronic packaging thermal management; Epoxy resins; Polymers; Silver; Thermal stability;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location
Shanghai
Print_ISBN
1-4244-0160-7
Electronic_ISBN
1-4244-0161-5
Type
conf
DOI
10.1109/ICSICT.2006.306653
Filename
4098314
Link To Document