• DocumentCode
    3468623
  • Title

    Topology-driven cell layout migration with collinear constraints

  • Author

    De-Shiun Fu ; Ying-Zhih Chaung ; Yen-Hung Lin ; Yih-Lang Li

  • Author_Institution
    Comput. Sci. Dept., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2009
  • fDate
    4-7 Oct. 2009
  • Firstpage
    439
  • Lastpage
    444
  • Abstract
    Traditional layout migration focuses on area minimization, thus suffered wire distortion, which caused loss of layout topology. A migrated layout inheriting original topology owns original design intention and predictable property, such as wire length which determines the path delay importantly. This work presents a new rectangular topological layout to preserve layout topology and combine its flexibility of handling wires with traditional scan-line based compaction algorithm for area minimization. The proposed migration flow contains devices and wires extraction, topological layout construction, unidirectional compression combining scan-line algorithm with collinear equation solver, and wire restoration. Experimental results show that cell topology is well preserved, and a several times runtime speedup is achieved as compared with recent migration research based on ILP (integer linear programming) formulation.
  • Keywords
    circuit layout; integer programming; linear programming; minimisation; network topology; wires (electric); ILP; area minimization; cell topology; collinear equation solver; integer linear programming; path delay; scan line based compaction algorithm; topological layout construction; topology driven cell layout migration; wire distortion; wire restoration; wires extraction; Algorithm design and analysis; Compaction; Delay; Foundries; Integer linear programming; Runtime; Semiconductor device manufacture; Shape; Topology; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design, 2009. ICCD 2009. IEEE International Conference on
  • Conference_Location
    Lake Tahoe, CA
  • ISSN
    1063-6404
  • Print_ISBN
    978-1-4244-5029-9
  • Type

    conf

  • DOI
    10.1109/ICCD.2009.5413118
  • Filename
    5413118