DocumentCode
3471141
Title
Preparation of solder plated patterns on paper and applying to RFID tags
Author
Sakai, Yoshiki ; Sasaki, Kazuhiko ; Futakuchi, Tomoaki ; Honda, Ken-ichi ; Hirose, Keikichi ; Inoda, Akihiro
Author_Institution
Toyama Ind. Technol. Center, Takaoka, Japan
fYear
2013
fDate
11-13 Nov. 2013
Firstpage
1
Lastpage
4
Abstract
In this study, we investigate the preparation of radio frequency identification tags on paper by using screen printing, solder plating, and self-alignment attachment. Waste-fluids are not produced in the proposed process. In addition, the process of preparing the tags involves fewer steps compared to the general process. Moreover, the prepared tags are heat resistant at temperatures greater than 200 °C.
Keywords
antenna radiation patterns; paper; radiofrequency identification; thermal resistance; RFID tags; heat resistant; paper; radio frequency identification tags; screen printing; self-alignment attachment; solder plated pattern; solder plating; Antennas; Heating; Integrated circuits; RFID tags; Resonant frequency; Wires; RFID tags; paper; screen printing; self-alignment;
fLanguage
English
Publisher
ieee
Conference_Titel
CPMT Symposium Japan (ICSJ), 2013 IEEE 3rd
Conference_Location
Kyoto
Print_ISBN
978-1-4799-2718-0
Type
conf
DOI
10.1109/ICSJ.2013.6756124
Filename
6756124
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