DocumentCode
3473393
Title
29th Annual Proceedings. Reliability Physics 1991 (Cat. No.91CH2974-4)
fYear
1991
fDate
9-11 April 1991
Keywords
ageing; failure analysis; life testing; metallisation; monolithic integrated circuits; packaging; aging; bipolar devices; burn-in; compound semiconductors; dielectrics; fabrication processes; failure analysis; hot carriers; life testing; memory devices; metallization; packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1991, 29th Annual Proceedings., International
Conference_Location
Las Vegas, NV, USA
Print_ISBN
0-87942-680-2
Type
conf
DOI
10.1109/RELPHY.1991.146043
Filename
146043
Link To Document