DocumentCode
3477073
Title
Synthesis of copper nanowires on the substrates in aqueous solution
Author
Yinping Deng ; Ning Wang ; Huiqin Ling ; Ming Li
Author_Institution
Inst. of Microelectron. Mater. & Technol., Shanghai Jiao Tong Univ., Shanghai, China
fYear
2013
fDate
11-14 Aug. 2013
Firstpage
148
Lastpage
151
Abstract
Copper nanowire is a promising material in the electronic packaging industry. However, at present, most of the preparation methods of Cu nanowires growing on substrates are highly dependent on templates or need relatively high temperature. In this study, Cu nanowires growing on substrates are synthesized by both pulse current electrodeposition and electroless plating, which is both template-free and conducted under mild conditions. The final morphology and structure of the products have been studied by X-ray diffraction method, scanning electron microscope and transmission electron microscope respectively. The Cu nanowires have smooth surfaces, with length between 10-30μm and diameter between 60-70nm. Moreover, the Cu nanowires have single-crystal structure of face-centered-cubic copper growing along the [100] direction.
Keywords
X-ray diffraction; copper; electroless deposition; electroplating; nanofabrication; nanowires; transmission electron microscopy; Cu; X-ray diffraction method; aqueous solution; copper nanowire morphology; copper nanowire preparation methods; copper nanowire structure; copper nanowire synthesis; electroless plating; electronic packaging industry; face centered cubic copper; pulse current electrodeposition; scanning electron microscopy; single crystal structure; size 10 mum to 30 mum; size 60 nm to 70 nm; substrates; template free nanowire synthesis; transmission electron microscopy; Copper; Crystallization; Electronics packaging; Nanowires; Substrates; Surface morphology; copper; electrodeposition; electroless plating; nanowire; substrate;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location
Dalian
Type
conf
DOI
10.1109/ICEPT.2013.6756443
Filename
6756443
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