Investigation on reliability of low-Ag lead-free solder alloy

Author

Yating Hu ; Bing An ; Yi Zhang ; Yiping Wu

Author_Institution

Instn. of Mater. Sci. & Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

334

Lastpage

337

Abstract

The main objective of this paper is to investigate the reliability of low-Ag lead-free solder alloy. The wettability, mechanical property and microstructure of Sn-1.0Ag-0.5Cu (SAC105) and Sn-3.0Ag-0.5Cu (SAC305) lead-free solder alloys were comparatively investigated. Experimental studies have shown that the wetting property of low-Ag lead-free solder alloy SAC105 remains to be improved and mechanical strength is lower to SAC305, but its anti-drop and anti-shock performance are outstanding. Though the wetting property of SAC105 is inferior to SAC305, the melting point and wettability of SAC105 can meet the actual reliability requirements of products. Matched with appropriate process, low-Ag lead-free solder can also form reliable solder joints to meet the reliability standards in industrial production.

Keywords

copper alloys; crystal microstructure; mechanical properties; reliability; silver alloys; solders; tin alloys; wetting; Sn-Ag-Cu; antidrop performance; antishock performance; industrial production; low-silver lead-free solder alloy reliability; mechanical property; mechanical strength; microstructure; wetting property; Lead; Mechanical factors; Reliability; Soldering; Substrates; SnAgCu; lead-free; microstructure; reliability; wettability;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756483

Filename

6756483