• DocumentCode
    347860
  • Title

    Semiconductor controlled rectifier (SCR) electrostatic discharge (ESD) protection devices in submicron CMOS technology

  • Author

    Lee, Jerri ; Syrzycki, Marek ; Iniewski, Kris

  • Author_Institution
    Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
  • Volume
    1
  • fYear
    1999
  • fDate
    9-12 May 1999
  • Firstpage
    409
  • Abstract
    Multiple designs of silicon controlled rectifier (SCR) devices as major electrostatic discharge (ESD) protection circuits in 0.35 micron CMOS technology are investigated to provide better insight into their operation. They are also compared with the conventional CMOS ESD protection circuits to investigate possible advantages in smaller silicon area, discharging paths with lower ON resistance and lower holding voltages. The I-V characteristics of designed and fabricated SCRs have been tested. Testing results allows proper tune-up of computational models such as lumped-element models and 2D device models for future use in simulation of I/O pads with ESD protection circuits. High voltage ESD testing using human body model (HBM) were also conducted revealing that designed structures are able to withstand the stress of 1 kV.
  • Keywords
    CMOS integrated circuits; electrostatic discharge; integrated circuit modelling; integrated circuit reliability; thyristors; 0.35 micron; 1 kV; 2D device models; ESD protection devices; I-V characteristics; I/O pads; ON resistance; computational models; designed structures; discharging paths; holding voltages; human body model; lumped-element models; semiconductor controlled rectifier; silicon area; submicron CMOS technology; Biological system modeling; CMOS technology; Circuit testing; Computational modeling; Electrostatic discharge; Protection; Semiconductor device modeling; Silicon; Thyristors; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical and Computer Engineering, 1999 IEEE Canadian Conference on
  • Conference_Location
    Edmonton, Alberta, Canada
  • ISSN
    0840-7789
  • Print_ISBN
    0-7803-5579-2
  • Type

    conf

  • DOI
    10.1109/CCECE.1999.807233
  • Filename
    807233