Finite element based DOE methodology for thermal fatigue reliability design of multi-row QFN packages

Author

Xia Guofeng ; Qin Fei ; Gao Cha ; An Tong ; Zhu Wenhui

Author_Institution

Coll. of Mech. Eng. & Appl. Electron. Technol., Beijing Univ. of Technol., Beijing, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

512

Lastpage

516

Abstract

A DOE (Design of Experiment) methodology based on finite element analysis is presented to investigate thermal fatigue reliability of multi-row QFN packages. In this method, the influences of material properties, structural geometries and temperature cycling profiles on thermal fatigue reliability are evaluated, a L27(3⁸) orthogonal array is built based on Taguchi method to figure out optimized factor combination design for promoting thermal fatigue reliability. Anand constitutive model is adopted to describe the viscoplastic behavior of lead-free solder Sn3.0Ag0.5Cu. The stress and strain in solder joints under temperature cycling are studied by 3D finite element model. The modified Coffin-Manson model is employed to predict the fatigue life of solder joints. Results indicate that CTE of PCB board, the height of solder joint and CTE of epoxy molding compound have critical influence on thermal fatigue life of solder joints. The fatigue life of multi-row QFN package with original design is 767 cycles, which can be substantially improved by 5.43 times to 4165 cycles after optimized factor combination design.

Keywords

Taguchi methods; copper alloys; design of experiments; electronics packaging; finite element analysis; reliability; silver alloys; solders; stress-strain relations; thermal expansion; thermal stress cracking; tin alloys; viscoplasticity; 3D finite element model; Anand constitutive model; CTE; PCB board; SnAgCu; Taguchi method; design of experiment; epoxy molding compound; finite element based DOE methodology; lead-free solder; material property; modified Coffin-Manson model; multirow QFN packages; optimized factor combination design; quad flat nonlead package; structural geometry; temperature cycling profiles; thermal fatigue life prediction; thermal fatigue reliability design; viscoplastic behavior; Fatigue; Finite element analysis; Plastics; Reliability; Soldering; Strain; Stress; DOE; electronics package; numerical simulation; thermal fatigue life;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756523

Filename

6756523