DocumentCode
3479854
Title
Metal Insulator Structures For Multichip Modules
Author
Kohl, Paul A.
Author_Institution
Georgia Institute of Technology
fYear
1991
fDate
16-18 April 1991
Firstpage
244
Lastpage
247
Abstract
The technology and material choices available for MCMs are discussed in terms of a cost-yield model. The basic building blocks of MCMs are presented and viewed in terms of the number of processing steps, defect density and processing costs.
Keywords
Adhesives; Chemical technology; Costs; Dielectrics and electrical insulation; Metal-insulator structures; Microstrip; Multichip modules; Packaging; Thermal conductivity; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electro International, 1991
Conference_Location
New York, NY, USA
Type
conf
DOI
10.1109/ELECTR.1991.718215
Filename
718215
Link To Document