DocumentCode
3479937
Title
Elastic and Conformable Electronic Circuits and Assemblies using MID in polymer
Author
Axisa, F. ; Brosteaux, D. ; De Leersnyder, E. ; Bossuyt, F. ; Gonzalez, M. ; Bulcke, Vanden M. ; Vanfleteren, J.
Author_Institution
lMEC/TFCG Microsyst., Ghent
fYear
2007
fDate
Jan. 16 2007-Yearly 18 2007
Firstpage
280
Lastpage
286
Abstract
For user comfort reasons, electronic circuits for implantation in the human body or for use as smart clothes should ideally be soft, stretchable and elastic. In this contribution the initial results of an MID (moulded interconnect device) technology will be presented, showing the feasibility of functional stretchable electronic circuits. In the developed technology rigid or flexible standard components are interconnected by meander shaped electroplated metallic wires and embedded by molding in a stretchable substrate polymer, like silicone rubber or polyurethane. The meander design was supported by mechanical simulations in order to minimize the stress in the metal during deformation. In this way reliable stretchability of the circuits above 100% has been demonstrated. A simple stretchable thermometer circuit with 4 components embedded in Dow Corning Silasticreg PDMS silicone material has been built and proper operation has been demonstrated.
Keywords
conducting polymers; flexible electronics; integrated circuit interconnections; prosthetics; thermometers; wearable computers; Dow Corning Silastic; PDMS silicone material; biomedical system; conductive polymer; conformable electronic circuit; elastic electronic circuit; human body implantation; meander design; moulded interconnect device; self-healing structure; smart clothes; stretchable electronic circuits; stretchable thermometer circuit; Assembly; Circuit simulation; Deformable models; Electronic circuits; Humans; Integrated circuit interconnections; Polymers; Rubber; Standards development; Wires; MID; Stretchable electronics; biomedical system; conductive polymer; electroplating; meander; self-healing structure;
fLanguage
English
Publisher
ieee
Conference_Titel
Polymers and Adhesives in Microelectronics and Photonics, 2007. Polytronic 2007. 6th International Conference on
Conference_Location
Odaiba, Tokyo
Print_ISBN
978-1-4244-1186-3
Electronic_ISBN
978-1-4244-1186-3
Type
conf
DOI
10.1109/POLYTR.2007.4339183
Filename
4339183
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