Mechanical property and reliability of anisotropic conductive adhesive in surface mount applications

Author

Huang Lin ; Zhou Liangjie ; Liu Hui ; Wu Fengshun ; Xia Weisheng ; Fu Hongzhi ; Wang Shiyu ; Liu Zhe

Author_Institution

Sch. of Mater. Sci. & Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

839

Lastpage

842

Abstract

Anisotropic conductive adhesive (ACA) offers a promising solution for fine-pitch interconnections, which is low cost, low temperature and environmentally clean. Good mechanical property and high reliability are both required for ACAs to be an alternative of solders. In this study, three types of ACAs and one lead-free solder were selected to investigate their mechanical properties and reliabilities. Shear strength test was conducted to study the mechanical property of the samples. Reflow test was performed to examine if the ACA could be compatible with SMT process, and the shock resistance was studied by the drop test. In addition, the temperature cycling test (-40 °C to 125 °C) and the 85 °C /85% RH thermal humidity storage test were conducted to study the reliability.

Keywords

circuit reliability; conductive adhesives; mechanical properties; printed circuit interconnections; surface mount technology; SMT process; anisotropic conductive adhesive reliability; fine pitch interconnection; mechanical properties; mechanical property; shear strength test; solder alternative; surface mount applications; temperature -40 C to 125 C; temperature cycling test; Conductive adhesives; Joints; Mechanical factors; Reliability; Substrates; Temperature measurement; Anisotropic conductive adhesive; Mechanical property; Reliability;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756594

Filename

6756594