Research on the rework process of the ceramic ball grid array package

Author

Yingzhuo Huang ; Bo Huang ; Pengrong Lin ; Yusheng Cao ; Binhao Lian ; Quanbin Yao

Author_Institution

Beijing Microelectron. Technol. Inst., Beijing, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

976

Lastpage

980

Abstract

Ceramic ball grid array (CBGA) package is becoming increasingly popular as a high-density, high I/O count and high-performance packaging formation in the application of the aviation and spaceflight area. However, the undeveloped rework process restricts the development of the CBGA process and the application of the CBGA component. This paper made a research on the rework process of the CBGA package, it specifically discussed the coplanarity, the position, the void rate and the solder joint strength. By design of the daisy-chain substrate, the board-level reliability of the CBGA package was investigated. This study showed that the reworked CBGA component with high strength, low void rate, good coplanarity and high reliability was available by the proper rework process and could meet the requirement of the formal product.

Keywords

ball grid arrays; ceramic packaging; reliability; CBGA; I/O count; board-level reliability; ceramic ball grid array package; daisy-chain substrate; rework process; solder joint strength; void rate; Ceramics; Electronics packaging; Joints; Reliability; Substrates; Surface morphology; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756623

Filename

6756623