• DocumentCode
    3481510
  • Title

    Modeling of satellite borne TDI CCD pitching imaging image motion velocity vector

  • Author

    Zhang, Liu ; Li, Shujun ; Jin, Guang ; Yang, Xiubin

  • Author_Institution
    Changchun Inst. of Opt., Fine Mech. & Phys., Chinese Acad. of Sci., Changchun, China
  • fYear
    2009
  • fDate
    5-7 Aug. 2009
  • Firstpage
    1587
  • Lastpage
    1591
  • Abstract
    In order to obtain three-dimensional observation effect with single satellite borne time delay and integrate charge coupled device (TDI-CCD), pitching imaging is required. More accurate real-time image motion velocity vector computational model of space camera is also necessary to make the imaging perfect. Imaging motion velocity vector computation model must be set up on image plane at pitching imaging. According to the geometric relationship between the pitching imaging space camera and the Earth´s rotation motion, satellite borne TDI CCD pitching imaging motion velocity vector model is derived by mapping the ground speed to the image plane and using coordinate transformation method. The numerical simulation results show that the image velocity model can reduce deviation angle error about 33´ and about 30% image motion speed error compared to traditional ground velocity model.
  • Keywords
    CCD image sensors; cameras; image motion analysis; numerical analysis; Earth rotation motion; coordinate transformation method; ground velocity model; integrate charge coupled device; numerical simulation result; pitching imaging image motion velocity vector; single satellite borne time delay; space camera; three-dimensional observation effect; Cameras; Charge coupled devices; Charge-coupled image sensors; Computational modeling; High-resolution imaging; Optical arrays; Optical imaging; Satellites; Space technology; Space vehicles; TDI CCD; image motion velocity; model; three-dimensional observation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Automation and Logistics, 2009. ICAL '09. IEEE International Conference on
  • Conference_Location
    Shenyang
  • Print_ISBN
    978-1-4244-4794-7
  • Electronic_ISBN
    978-1-4244-4795-4
  • Type

    conf

  • DOI
    10.1109/ICAL.2009.5262713
  • Filename
    5262713