Nano materials for microelectronic and photonic packaging

Author

Lin, W. ; Jiang, H. ; Zhang, R. ; Liang, Q. ; Lu, J. ; Xiu, Y. ; Moon, K. ; Hildreth, O. ; Wong, C.P.

Author_Institution

Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA

fYear

2008

fDate

17-20 Aug. 2008

Firstpage

1

Lastpage

5

Abstract

This paper addresses the state of art nano science and technology regarding next generation high density microelectronics and photonics packaging applications, including carbon nanotubes (CNTs) for electrical/thermal devices, nano lead-free alloy, molecular wires for electrical interconnects, etc.

Keywords

carbon nanotubes; integrated circuit packaging; nanostructured materials; carbon nanotubes; electrical interconnects; electrical/thermal devices; high density microelectronics; molecular wires; nano lead-free alloy; nanomaterials; photonic packaging; Chemical technology; Electronic packaging thermal management; Environmentally friendly manufacturing techniques; Lead; Microelectronics; Nanobioscience; Nanoparticles; Photonics; Thermal conductivity; Thermal engineering;

fLanguage

English

Publisher

ieee

Conference_Titel

Portable Information Devices, 2008 and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. PORTABLE-POLYTRONIC 2008. 2nd IEEE International Interdisciplinary Conference on

Conference_Location

Garmish-Partenkirchen

Print_ISBN

978-1-4244-2141-1

Electronic_ISBN

978-1-4244-2142-8

Type

conf

DOI

10.1109/PORTABLE-POLYTRONIC.2008.4681291

Filename

4681291