Delamination modeling in LED package by cohesive zone method

Author

Bingbing Zhang ; Daoguo Yang

Author_Institution

Guilin Univ. of Electron. Technol., Guilin, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

1217

Lastpage

1221

Abstract

Reliability problem is becoming a bottleneck of LED application in different fields. Delamination is one of them in light emitting diode during operation. In order to better understand the process of delamination the three-dimensional finite element method with cohesive zone elements was established to know it. The maximum Von Mises stress was found at the interface between die and die attach. The influence of ambient temperature on the level of delamination was investigated with sub-model technique. Meanwhile the cohesive zone method has a good prediction of interface delamination.

Keywords

delamination; finite element analysis; light emitting diodes; packaging; semiconductor device models; semiconductor device reliability; LED package; cohesive zone method; delamination modeling; interface delamination; light emitting diode; maximum Von Mises stress; reliability; three-dimensional finite element method; Delamination; Electronic packaging thermal management; Finite element analysis; Light emitting diodes; Microassembly; Packaging; Stress; LED; cohesive zone element; delamination; sub-model; thermo-structure analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756677

Filename

6756677