Multilayer thick-film photoimageable technology for 60 GHz system-in-package

The 60 GHz band has been the subject of interest for over 20 years as it is an attractive proposition for high data rate communications for secure or pico-cellular systems where the high attenuation (10-15dB/km) of the oxygen line is advantageous. A number of professional-level commercial Gigabit Ethernet point-to-point systems have been implemented, such as Rayawave´s AireBeam^TM and the ProximWireless GigaLinkreg Series. The exciting new prospect for the exploitation of the 60 GHz band is the realisation of transceiver circuits in Si/SiGe at 60 GHz and the work to define new standards for 60 GHz wireless PANs and wireless HDMI in the home, mainly in IEEE 802.15.3c. Whilst silicon transceivers are the key enabling technology, for the foreseeable future these will require supplementary off-chip components such as antennas, filters and other passive components, even though the short wavelength at 60 GHz makes it possible to integrate them. The conclusion is, therefore, that a system-in-package approach is a suitable way of realising a 60 GHz module for the price-conscious consumer electronics market.