• DocumentCode
    3490016
  • Title

    Electric field breakdown mechanisms in high power epitaxial 4H-SiC p-n junction diodes

  • Author

    Tin, C.C. ; Madangarli, V. ; Luckowski, E. ; Casady, J. ; Isaacs-Smith, T. ; Williams, J.R. ; Johnson, R.W. ; Gradinaru, G. ; Sudarshan, T.S.

  • Author_Institution
    Dept. of Phys., Auburn Univ., AL, USA
  • fYear
    1996
  • fDate
    26-28 Nov 1996
  • Firstpage
    55
  • Lastpage
    58
  • Abstract
    Silicon carbide (SiC) is an excellent semiconductor for the fabrication of high power and high temperature electronic devices. SiC pn junctions are critical components of SiC high power devices and circuits. However, the high electric field behavior of SiC p-n junction structures is not well characterized. The study of the high field breakdown mechanisms of SiC p-n junction plays an important role in determining the proper design of SiC high power p-n junction-based devices. We have determined the high field breakdown behaviors of several types of 4H-SiC epitaxial p-n junction diodes of different design. In our efforts to increase the breakdown voltage, we have found that oxide passivation did not substantially affect the breakdown voltage but edge termination using argon ion implantation is effective in improving the breakdown voltage of SiC-p-n junction diodes
  • Keywords
    electric breakdown; p-n junctions; power semiconductor diodes; semiconductor epitaxial layers; silicon compounds; wide band gap semiconductors; SiC; argon ion implantation; edge termination; electric field breakdown; electronic device; high power epitaxial 4H-SiC p-n junction diode; oxide passivation; semiconductor; silicon carbide; Argon; Circuits; Electric breakdown; Fabrication; Ion implantation; P-n junctions; Passivation; Semiconductor diodes; Silicon carbide; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics, 1996. ICSE '96. Proceedings., 1996 IEEE International Conference on
  • Conference_Location
    Penang
  • Print_ISBN
    0-7803-3388-8
  • Type

    conf

  • DOI
    10.1109/SMELEC.1996.616451
  • Filename
    616451