DocumentCode
3490016
Title
Electric field breakdown mechanisms in high power epitaxial 4H-SiC p-n junction diodes
Author
Tin, C.C. ; Madangarli, V. ; Luckowski, E. ; Casady, J. ; Isaacs-Smith, T. ; Williams, J.R. ; Johnson, R.W. ; Gradinaru, G. ; Sudarshan, T.S.
Author_Institution
Dept. of Phys., Auburn Univ., AL, USA
fYear
1996
fDate
26-28 Nov 1996
Firstpage
55
Lastpage
58
Abstract
Silicon carbide (SiC) is an excellent semiconductor for the fabrication of high power and high temperature electronic devices. SiC pn junctions are critical components of SiC high power devices and circuits. However, the high electric field behavior of SiC p-n junction structures is not well characterized. The study of the high field breakdown mechanisms of SiC p-n junction plays an important role in determining the proper design of SiC high power p-n junction-based devices. We have determined the high field breakdown behaviors of several types of 4H-SiC epitaxial p-n junction diodes of different design. In our efforts to increase the breakdown voltage, we have found that oxide passivation did not substantially affect the breakdown voltage but edge termination using argon ion implantation is effective in improving the breakdown voltage of SiC-p-n junction diodes
Keywords
electric breakdown; p-n junctions; power semiconductor diodes; semiconductor epitaxial layers; silicon compounds; wide band gap semiconductors; SiC; argon ion implantation; edge termination; electric field breakdown; electronic device; high power epitaxial 4H-SiC p-n junction diode; oxide passivation; semiconductor; silicon carbide; Argon; Circuits; Electric breakdown; Fabrication; Ion implantation; P-n junctions; Passivation; Semiconductor diodes; Silicon carbide; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics, 1996. ICSE '96. Proceedings., 1996 IEEE International Conference on
Conference_Location
Penang
Print_ISBN
0-7803-3388-8
Type
conf
DOI
10.1109/SMELEC.1996.616451
Filename
616451
Link To Document