A multilayer PCB material modeling approach based on laminate theory

After surveying the laminate theory, this paper presents a field proven 3-steps concept for modeling printed circuit boards (PCB). First, the behavior of the single plies is studied by means of a 3D detailed model representing a typical cell. Afterwards, the laminate theory is applied to transfer the material data determined in the first step to a 3-layers model, which eventually allows modeling full PCBs in regular FEM simulations of complete electronic modules. Finally, the model of a 10-layer PCB is assembled and correlated to experimental data within the temperature range from 25degC to 150degC. Numerous experimental tests validate throughout the study that the model build-up this way is able to capture reality within a 5% accuracy band.