New method of dynamic compact thermal model extraction

A compact thermal model extraction method for multi-chip power electronics systems is proposed. Innovative and accurate, it accounts for dynamic thermal coupling between multiple heat sources. The use of this model permits system designers to easily take into account transient electro-thermal coupling. The method is based on a definition of the optimal thermal coupling point, which is proven to be suitable even under transient conditions. Compared to the existing methods, the number of needed 3D thermal simulations or measurements for the model deduction is significantly reduced.