• DocumentCode
    3490649
  • Title

    Coupled circuit-electromagnetic simulation using time domain integral equation

  • Author

    Wang, Wen-ju ; Liu, Feng ; Zhou, Dong-Ming ; He, Jian-Guo

  • Author_Institution
    Sch. of Electron. Sci. & Eng., Nat. Univ. of Defense Technol., Changsha
  • fYear
    2008
  • fDate
    16-20 Dec. 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Time-domain integral equation solvers are highly suited for analyzing the performance of coupled circuit-electromagnetic (EM) systems when broadband information is required or nonlinearities in the system have to be modeled accurately. In this paper, we present a novel coupling scheme for hybridizing TDIE with modified nodal analysis (MNA) used in circuit simulation of linear and nonlinear circuits. The coupling scheme is based on the concept of a coupling current that bridges circuit and EM domains. This approach has the advantage of modeling arbitrarily shaped structures with surface-only formulations, and of incorporating skin effects automatically with no volumetric meshing. The method enables direct solution of circuit- EM equations without the need for generating port models, and permits both circuit and EM excitations which has potential as a signal integrity and as an EMI/EMC modeling tool.
  • Keywords
    circuit simulation; computational electromagnetics; coupled circuits; electromagnetic coupling; electromagnetic interference; integral equations; time-domain analysis; EM excitations; broadband information; circuit simulation; coupled circuit-electromagnetic simulation; coupled circuit-electromagnetic systems; coupling current; modified nodal analysis; nonlinear circuits; signal integrity; surface-only formulations; time domain integral equation; volumetric meshing; Bridge circuits; Circuit simulation; Coupled mode analysis; Coupling circuits; Information analysis; Integral equations; Nonlinear circuits; Performance analysis; Skin effect; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2008. APMC 2008. Asia-Pacific
  • Conference_Location
    Macau
  • Print_ISBN
    978-1-4244-2641-6
  • Electronic_ISBN
    978-1-4244-2642-3
  • Type

    conf

  • DOI
    10.1109/APMC.2008.4958507
  • Filename
    4958507