DocumentCode
3494860
Title
Semi-insulating Czochralski-silicon for Radio Frequency Applications
Author
Mallik, Kanad ; de Groot, C.H. ; Ashburn, P. ; Wilshaw, P.R.
Author_Institution
Sch. of Electron. & Comput. Sci., Southampton Univ.
fYear
2006
fDate
Sept. 2006
Firstpage
435
Lastpage
438
Abstract
Deep level manganese doping by ion implantation and rapid thermal annealing have been used for the first time to make very high resistivity Czochralski silicon substrates up to 10 kOmegacm and on the average, this is nearly a ten-fold increase over the resistivity of the undoped starting wafer. The material is ideally suited for making semi-insulating silicon handle wafers for radio frequency silicon devices. Interesting features, like trapping by end-of range defects, out-diffusion and partial activation of Mn dopant atoms have been observed
Keywords
crystal growth from melt; elemental semiconductors; ion implantation; manganese; rapid thermal annealing; semiconductor doping; silicon; Czochralski silicon substrates; Mn; Mn dopant atoms; Si; deep level manganese doping; ion implantation; radio frequency silicon devices; rapid thermal annealing; semi-insulating Czochralski-silicon; silicon handle wafers; undoped starting wafer; Annealing; Conductivity; Doping; Gallium arsenide; Manganese; Photonic band gap; Radio frequency; Silicon; Substrates; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Device Research Conference, 2006. ESSDERC 2006. Proceeding of the 36th European
Conference_Location
Montreux
ISSN
1930-8876
Print_ISBN
1-4244-0301-4
Type
conf
DOI
10.1109/ESSDER.2006.307731
Filename
4099949
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