• DocumentCode
    3498186
  • Title

    Piezoelectric properties of ScAlN thin films for piezo-MEMS devices

  • Author

    Umeda, Kazunori ; Kawai, Hiroyuki ; Honda, A. ; Akiyama, Masanori ; Kato, Toshihiko ; Fukura, T.

  • Author_Institution
    Murata Manuf. Co., Ltd., Japan
  • fYear
    2013
  • fDate
    20-24 Jan. 2013
  • Firstpage
    733
  • Lastpage
    736
  • Abstract
    This paper reports the piezoelectric properties of ScAlN thin films. We evaluated the piezoelectric coefficients d33 and d31 of ScxAl1-xN thin films directly deposited onto silicon wafers, as well the radio frequency (RF) electrical characteristics of Sc0.35Al0.65N bulk acoustic wave (BAW) resonators at around 2 GHz, and found a maximum value for d33 of 28 pC/N and a maximum -d31 of 13 pm/V at 40% scandium concentration. In BAW resonators that use Sc0.35Al0.65N as a piezoelectric film, the electromechanical coupling coefficient k2 (=15.5%) was found to be 2.6 times that of resonators with AlN films. These experimental results are in very close agreement with first-principles calculations. The large electromechanical coupling coefficient and high sound velocity of these films should make them suitable for high frequency applications.
  • Keywords
    ab initio calculations; acoustic resonators; bulk acoustic wave devices; elemental semiconductors; microfabrication; micromechanical devices; piezoelectric devices; piezoelectric thin films; piezoelectricity; scandium compounds; silicon; thin film devices; BAW; RF electrical characteristics; Sc0.35Al0.65N-Si; bulk acoustic wave resonator; electromechanical coupling coefficient; first-principles calculation; microfabrication; piezoMEMS device; piezoelectric coefficient evaluation; piezoelectric property; piezoelectric thin film; radiofrequency electrical characteristics; scandium concentration; silicon wafer deposition; Electrodes; Films; Frequency measurement; Resonant frequency; Sputtering; Substrates; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
  • Conference_Location
    Taipei
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4673-5654-1
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2013.6474347
  • Filename
    6474347